From wafer inspection to laser assisted bonding
Lasers in Semiconductor production

Typical applications of diode laser beam sources in electronics and semiconductor production are systems for optoelectrical quality inspection of wafers (wafer prober), or the laser-assisted soldering of highly complex electronic components such as flip chips - often referred to as Laser Assisted Bonding or LAB.

Laser deployment in the electronics industry

Laser beam sources in the semiconductor sector have been pretty common since the 1990s. Whereas initially components were marked and labeled at the end of the production line, today we would rather speak of production steps. These range from drilling, separating elements (dicing), cutting wafers, metals and plastics over lighting for troubleshooting at intermediate products to different thermal processes. Depending on the application, differently pulsed CW laser systems with a very broad power range from sub-mW to multi kW are used.

If you choose any two application fields for diode lasers, there are lasers in the optoelectronic testing of wafers to analyze defect bridge elements, tungsten residues or scratches in the oxide layers. In this way, defective wafers can be recognized well before any further processing, and can thus be sorted out in time. A second application field is the brazing of electronic components with quite individually tailored solutions for different customers.

Alternative to reflow soldering

High-power diode lasers are mainly known as tools for industrial metalworking. In the meantime, however, solutions for the electronics industry are also increasingly being discussed. In addition to joining and cladding copper components, for which Laserline developed the world's first blue diode laser with CW laser power in the kilowatt range, semiconductor production is also becoming increasingly important. What's behind all this is revealed in an interview with Markus Rütering, Sales Director at Laserline.

 

KLA Supplier Excellence Award 2019

Laserline high-power diode lasers  have been successfully used in KLA system solutions for optoelectrical testing of wafers for many years. The Supplier Excellence Awards 2019 were presented to Laserline and two other suppliers for outstanding performance in their respective categories in the areas of technology, quality, responsiveness, delivery and cost. We are proud of this special award from one of our most important business partners in the electronics industry.


KLA develops industry-leading equipment and services that enable innovation throughout the electronics industry. These include advanced process control and process-enabling solutions for manufacturing wafers and reticles, integrated circuits, packaging, printed circuit boards and flat panel displays. In close collaboration with leading customers across the globe, expert teams of physicists, engineers, data scientists and problem-solvers design solutions that move the world forward. Additional information may be found at www.kla.com (KLAC-F).